特別針對每年處理幾百萬個品項的大量物流設計,ICODE 提供低成本、可重新程式設計和可棄置的解決方案,適用於來源標籤、自動資料擷取、防盜保護和產品或其包裝上的資料儲存。
ICODE 是高頻 (HF) 智慧型標籤解決方案的產業標準,售出超過 7 億顆晶片,代表在全世界最廣為採用,ICODE 是廣受肯定的可靠技術。整個 ICODE 系列都符合 ISO 15693、ISO 18000-3 和 EPCglobal 相容基礎架構。在和終端使用者與系統整合商緊密合作下開發出來的 ICODE,提供了市場上最佳的價格/效能比。
ICODE 為開放平台,提供給所有願意開發、行銷和銷售 ICODE 相容產品與服務的公司。由於我們的開放價值鏈策略,無論您是智慧型標籤製造商、元件供應商或系統整合商,恩智浦都是您提供全球標竿 RFID 解決方案的理想夥伴 。
ICODE 介面平台目前包括:
Request-Form for Passwords for Confidential ICODE Documents (18kB)
SL1 ICS30 01, ICODE1 Label IC, Chip Specification (368kB)
SL1 ICS30 01, Bumped ICODE1 Label IC (IC with Bumps),Chip Specification (375kB)
SL1 ICS31 01; ICODE1 Label IC(97pF) Chip Specification (366kB)
SL1 ICS31 01; ICODE1 Label IC(97pF); (IC with Bumps) Chip Specification (377kB)
ICODE1 Label ICs, Protocol Air Interface, Datasheet (370kB)
Addendum, SL1 MOA2 S30, Contactless Chip Card Module Specification (32kB)
SL2 ICS10; ICODE EPC Smart Label IC; Functional Specifictaion (550kB)
SL2 ICS10; ICODE EPC Smart Label IC; Bumped Wafer Specification (203kB)
SL2 ICS11; ICODE UID Smart Label IC; Functional Specification (582kB)
Addendum, SL2 ICS 11; ICODE UID Smart Label IC; Bumped Wafer Specification (197kB)
NXP ICODE UID-OTP smart label IC SL2 ICS12 (521kB)
Short Form Specification; ICODE SLI; SL2 ICS20 Smart Label ISO IC (71kB)
ICODE SLI; Smart Label IC; SL2 ICS20 Functional Specification (79kB)
Addendum, SL2 FCS20 I-CONNECT SLI Flip Chip Package Specification (29kB)
Addendum, SL2 ICS20, ICODE SLI Label IC, Bumped Wafer Specification (41kB)
SL2 ICS50/SL2 ICS51 ICODE SLI-L/ I CODE SLI-L/HC (785kB)
SL2 ICS50 Wafer addendum (2,747kB)
SL2 ICS51 Wafer addendum (2,935kB)
SL2 ICS53/SL2 ICS54 ICODE SLI-S/HC Functional Specification (941kB)
SL2 ICS53 Wafer Addendum (2,746kB)
SL2 ICS54 Wafer Addendum (2,935kB)
ICODE1 System Design Guide (488kB)
ICODE1; Guidelines on the use of ICODE1 label ICs concerning the different input capacitances, Application Note (41kB)
ICODE 1 Label IC, Coil Design Guide, Application Note (164kB)
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ICODE Design of Read/Write Antennas, Application Note (555kB)
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Temperature Management; Inlet design, Application Note (108kB)
Delivery Type Specification; General Specification for 8 inch Wafer (279kB)
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Delivery Type Specification; FCP2 Flip Chip Package Specification (1,280kB)
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Processing of Flip Chip Package (147kB)
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General Specification for Packages in super 35mm reel Format; Data Sheet (369kB)