This page brings together detailed packaging information, for both discrete and IC packages.
It includes:

• a package tree, enabling you to explore our total packaging offer quickly. Click on any branch to expand further sub-branches
• a dedicated packaging search engine, which accepts partial package names
• a search for packages using the Philips marking code.

Package Tree

To find a package you can browse the package tree.

  Ceramic (75)
  Glass (16)
  Metal (1)
  Plastic (690)

# Package version Package name Package description Reference codes Issue date 1 SOT566-1  HSOP24  plastic, heatsink small outline package; 24 leads    2003-7-23  2 SOT819-1  HLLGA28R  plastic thermal enhanced low profile land grid array package; 28 lands; resin based; body 6 x 6 x 1.4 mm    2007-11-14  3 SOT619-3  HVQFN48  plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm  MO-220 (JEDEC)  2001-9-7  4 SOT533A  IPAK  plastic single-ended package (IPAK); 3 short leads (in line)  TO-251 (JEDEC)  2008-8-7  5 SOT840-1  HLLGA52R  plastic thermal enhanced low profile land grid array package; 52 lands; resin based; body 8 x 7 x 1.4 mm    2007-11-14  6 SOT409A1  CDIP8  ceramic surface mounted package; 8 leads    2001-3-1  7 SOT1113-1  HVQFN44  plastic thermal enhanced very thin quad flat package; no leads; 44 terminals; body 9 x 9 x 0.85 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2008-8-29  8 SOT1032-1  HVQFN108U  plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; UTLP based; body 8 x 8 x 0.9 mm    2008-10-17  9 SOT619-4  HVQFN48  plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm  MO-220 (JEDEC)  2002-9-30  10 SOT1129-1  BGA324  plastic ball grid array package; 324 balls; body 23 x 23 x 1.78 mm  --- (JEITA) MS-034 (JEDEC) 144E (IEC)  2009-2-5  11 SOT943-1  HUQFN68U  plastic thermal enhanced ultra thin quad flat package; no leads; 68 terminals; body 8 x 8 x 0.55 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2007-11-14  12 SOT944-1  HWQFN68  plastic thermal enhanced very very thin quad flat package; no leads; 68 terminals; body 8 x 8 x 0.65 mm    2006-6-1  13 SOT1032-2  HVQFN108U  plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; low stand-off height; UTLP based; body 8 x 8 x 0.9 mm    2008-10-16  14 SOT630-2  TFBGA112  plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.7 mm  MO-195 (JEDEC)  2006-4-27  15 SOT1099-1  LQFP256  plastic low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm  MS-026 (JEDEC) 136E31 (IEC)  2009-4-8  16 SOT1092-1  HVQFN36  plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm  MO-220 (JEDEC)  2008-11-12  17 SOT1036-1  HUQFN76U  plastic thermal enhanced ultra thin quad flat package; no leads; 76 terminals; UTLP based; body 6 x 6 x 0.55 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2007-12-1  18 SOT1119-1  HBGA432  plastic thermal enhanced ball grid array package; 432 balls; heatsink  --- (JEITA) MS-034 (JEDEC) 144E (IEC)  2008-10-15  19 SOD95  TO-220  plastic single-ended package; low-profile 2-lead TO-220  low-profile 2-lead TO-220 (JEDEC)  1999-9-13  20 SOT867-1  SOJ36  plastic small outline package; 36 leads (J-bent); body width 4.9 mm MAG NIET op WWW!!!    2004-12-14  21 SOD27-1  SOD27  Hermetically sealed glass package; axial leaded; 2 leads  SC-40 (JEITA) DO-35 (JEDEC) A24 (IEC)  2005-12-22  22 SOT1123-1  HBGA  plastic thermal enhanced ball grid array package; 324 balls; heatsink  - - - (JEITA) MS-034 (JEDEC) 144E (IEC)  2008-11-13  23 SOT684-8  HVQFN56  plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm  - - - (JEITA) - - - (JEDEC) - - - (IEC)  2009-2-24  24 SOT1030-1  HVQFN32  plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2007-10-17  25 SOT1097-1  LBGA228  plastic low profile ball grid array package; 228 balls  - - - (JEITA) - - - (JEDEC) - - - (IEC)  2008-11-17  26 SOT1114-1  HWQFN56R  plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 7 x 7 x 0.7 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2008-10-7  27 SOT975B  CDFM2  Earless flanged ceramic package; 2 leads    2007-9-28  28 SOT1141-1  LFBGA385  plastic low profile fine-pitch ball grid array package; 385 balls  - - - (JEDEC)  2009-5-25  29 SOD128  FlatPower  plastic surface-mounted package; 2 leads    2007-9-12  30 SOT650-2  HVSON10  plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm  - - - (JEITA) MO-229 (JEDEC) - - - (IEC)  2009-3-18  31 SOT409B1  CDIP8  ceramic surface mounted package; 8 leads    1998-1-27  32 SOT274-1  SDIP64  plastic shrink dual in-line package; 64 leads (750 mil)  MS-021 (JEDEC)  2003-2-13  33 SOT464-1  HSQFP240  plastic, heatsink shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm    1999-11-12  34 SOT619-9  HVQFN48  plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm  - - - (JEITA) MO-220 (JEDEC) - - - (IEC)  2008-11-13  35 SOT1098-1  LFBGA268  plastic low profile fine-pitch ball grid array package; 268 balls    2008-11-17  36 SOT1007A  DFM6  Plastic flanged cavity package; 2 mounting slots; 6 leads    2008-12-16  37 SOT1092-2  HVQFN36  plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm  - - - (JEITA) - - - (JEDEC)  2009-2-24  38 SOT96-2  SO8  plastic small outline package; 8 leads (straight); body width 3.9 mm    2006-8-1  39 SOT1095-1  HBGA624  plastic thermal enhanced ball grid array package; 624 balls; heatsink  - - - (JEITA) - - - (JEDEC) - - - (IEC)  2008-11-17  40 SOT318-5  QFP80  plastic quad flat package; 80 leads (lead length 1.95 mm; slope angle 60 deg); body 14 x 20 x 2.8 mm    2003-2-25  41 SOT1086-1  HVSON14  plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4.5 x 0.85 mm  MO-229 (JEDEC)  2008-7-3  42 sot804-3  HVQFN64  plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm  - - - (JEITA) - - - (JEDEC) - - - (IEC)  2009-2-24  43 SOT1102-1  BGA456  BGA456: plastic ball grid array package; 456 balls  - - - (JEITA) MS-034 (JEDEC) 144E (IEC)  2008-11-19  44 SOT122F  CRPM4  studded ceramic package; 4 leads    1999-3-29  45 SOT322-3  QFP160  plastic quad flat package;160 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; lead angle 60 deg  MO-112 (JEDEC)  2004-9-13  46 SOD81  GALF2  hermetically sealed glass package; ImplotecTM(1) technology; axial leaded; 2 leads    1997-6-20  47 SOT942-1  HUQFN88U  plastic thermal enhanced ultra thin quad flat package; no leads; 88 terminals; body 6 x 6 x 0.55 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2007-11-14  48 SOT1000-1  HVQFN36R  plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 6 x 5 x 0.85 mm    2008-3-14  49 SOT618-6  HVQFN40  plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm  - - - (JEITA) MO-220 (JEDEC)  2009-3-4  50 SOT941-2  HVQFN112U  plastic thermal enhanced very thin quad flat package; no leads; 112 terminals; UTLP based; body 7 x 7 x 0.9 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2007-11-14  51 SOD91  GALF2  hermetically sealed glass package; ImplotecTM(1) technology; axial leaded; 2 leads    1997-6-9  52 SOT1094-1  BGA376  plastic ball grid array package; 376 balls  - - - (JEITA) MS-034 (JEDEC) 144E (IEC)  2008-11-14  53 SOT1108-1  MTSSN4R  metal thin special-shape package; no leads; 4 terminals; resin based; body 4 x 3 x 1 mm  - - - (JEDEC) - - - (IEC)  2008-8-20  54 SOT1061  HUSON3  plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm  - - - (JEDEC)  2008-10-7  55 SOT1093-1  TQFP80  TQFP80: plastic thin quad flat package; 80 leads; body 14 x 14 x 1.1 mm  MS-026 (JEDEC) 136E19 (IEC)  2008-11-14  56 SOT102-2  DIP18  plastic dual in-line package; 18 leads (300 mil); slim corner leads    2003-2-13  57 SOT941-1  HVQFN112U  plastic thermal enhanced very thin quad flat package; no leads; 112 terminals; body 7 x 7 x 0.9 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2007-11-14  58 SOT935-1  HLQFN56R  plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based; body 8 x 8 x 1.25 mm  --- (JEITA) --- (JEDEC)  2007-11-14  59 SOT96-3  SO8  plastic small outline package; 8 leads; body width 3.9 mm; body thickness 1.47 mm  MS-012 (JEDEC)  2006-8-25  60 SOT838-1  HLLGA68R  plastic thermal enhanced low profile land grid array package; 68 lands; resin based; body 10 x 10 x 1.4 mm    2007-11-14  61 SOT865-3  HVQFN32  plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm  MO-220 (JEDEC)  2009-2-5  62 SOT1096-1  BGA452  plastic ball grid array package; 452 balls  MS-034 (JEDEC) 144E (IEC)  2008-11-14  63 sot1032-3  HVQFN108U  plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; low stand-off height; UTLP based; body 8 x 8 x 0.9 mm    2008-10-17  64 SOT865-2  HVQFN32  plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm    2009-3-5  65 SOT186B  TO-220F  plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 "full pack"    2002-3-12  66 SOT1023  LFPAK2  Plastic single-ende surface-mounted package (LFPAK2); 4 leads    2008-10-13  67 SOT1128-1  HLQFP256  plastic thermal enhanced low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm; heatsink  MS-026 (JEDEC)  2008-12-19  68 SOT1129-2  BGA324  plastic ball grid array package; 324 balls  - - - (JEITA) MS-034 (JEDEC) 144E (IEC)  2009-3-31  69 SOT979A  CDFM2  Flanged LDMOST ceramic package; 2 mounting holes; 4 leads    2008-9-4  70 SOT922-1  CDFM2  Ceramic earless flanged cavity package; 2 leads    2005-11-22  71 SOT638-4  HTQFP100  plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad  MS-026 (JEDEC)  2008-11-12  72 SOT1006A  DFM8  Plastic flanged cavity package; 2 mounting slots; 8 leads    2008-12-15  73 SOT1131-1  HSOP44  plastic, heatsink small outline package; 44 leads; low stand-off height    2009-3-23  74 SOT684-9  HVQFN56  plastic thermal enhanced very thin quad flat package; no leads; 56 terminals  - - - - - - - - (JEITA) - - - - - - - - (JEDEC) - - - - - - - - (IEC)  2009-5-25  75 SOT612-5  HLQFP144  plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad  MS-026 (JEDEC)  2008-11-21  76 SOT841-4  HTQFP80  plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad  MS-026 (JEDEC)  2006-6-20  77 SOT1136-1  BGA420  plastic ball grid array package; 420 balls  - - - (JEITA) MS-034 (JEDEC) 144E (IEC)  2009-5-20