| # | Package version | Package name | Package description | Reference codes | Issue date |
| 1 |
SOT566-1 |
HSOP24 |
plastic, heatsink small outline package; 24 leads |
|
2003-7-23 |
| 2 |
SOT819-1 |
HLLGA28R |
plastic thermal enhanced low profile land grid array package; 28 lands; resin based; body 6 x 6 x 1.4 mm |
|
2007-11-14 |
| 3 |
SOT619-3 |
HVQFN48 |
plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm |
MO-220 (JEDEC) |
2001-9-7 |
| 4 |
SOT533A |
IPAK |
plastic single-ended package (IPAK); 3 short leads (in line) |
TO-251 (JEDEC) |
2008-8-7 |
| 5 |
SOT840-1 |
HLLGA52R |
plastic thermal enhanced low profile land grid array package; 52 lands; resin based; body 8 x 7 x 1.4 mm |
|
2007-11-14 |
| 6 |
SOT409A1 |
CDIP8 |
ceramic surface mounted package; 8 leads |
|
2001-3-1 |
| 7 |
SOT1113-1 |
HVQFN44 |
plastic thermal enhanced very thin quad flat package; no leads; 44 terminals; body 9 x 9 x 0.85 mm |
--- (JEITA) --- (JEDEC) --- (IEC) |
2008-8-29 |
| 8 |
SOT1032-1 |
HVQFN108U |
plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; UTLP based; body 8 x 8 x 0.9 mm |
|
2008-10-17 |
| 9 |
SOT619-4 |
HVQFN48 |
plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm |
MO-220 (JEDEC) |
2002-9-30 |
| 10 |
SOT1129-1 |
BGA324 |
plastic ball grid array package; 324 balls; body 23 x 23 x 1.78 mm |
--- (JEITA) MS-034 (JEDEC) 144E (IEC) |
2009-2-5 |
| 11 |
SOT943-1 |
HUQFN68U |
plastic thermal enhanced ultra thin quad flat package; no leads; 68 terminals; body 8 x 8 x 0.55 mm |
--- (JEITA) --- (JEDEC) --- (IEC) |
2007-11-14 |
| 12 |
SOT944-1 |
HWQFN68 |
plastic thermal enhanced very very thin quad flat package; no leads; 68 terminals; body 8 x 8 x 0.65 mm |
|
2006-6-1 |
| 13 |
SOT1032-2 |
HVQFN108U |
plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; low stand-off height; UTLP based; body 8 x 8 x 0.9 mm |
|
2008-10-16 |
| 14 |
SOT630-2 |
TFBGA112 |
plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.7 mm |
MO-195 (JEDEC) |
2006-4-27 |
| 15 |
SOT1099-1 |
LQFP256 |
plastic low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm |
MS-026 (JEDEC) 136E31 (IEC) |
2009-4-8 |
| 16 |
SOT1092-1 |
HVQFN36 |
plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm |
MO-220 (JEDEC) |
2008-11-12 |
| 17 |
SOT1036-1 |
HUQFN76U |
plastic thermal enhanced ultra thin quad flat package; no leads; 76 terminals; UTLP based; body 6 x 6 x 0.55 mm |
--- (JEITA) --- (JEDEC) --- (IEC) |
2007-12-1 |
| 18 |
SOT1119-1 |
HBGA432 |
plastic thermal enhanced ball grid array package; 432 balls; heatsink |
--- (JEITA) MS-034 (JEDEC) 144E (IEC) |
2008-10-15 |
| 19 |
SOD95 |
TO-220 |
plastic single-ended package; low-profile 2-lead TO-220 |
low-profile 2-lead TO-220 (JEDEC) |
1999-9-13 |
| 20 |
SOT867-1 |
SOJ36 |
plastic small outline package; 36 leads (J-bent); body width 4.9 mm MAG NIET op WWW!!! |
|
2004-12-14 |
| 21 |
SOD27-1 |
SOD27 |
Hermetically sealed glass package; axial leaded; 2 leads |
SC-40 (JEITA) DO-35 (JEDEC) A24 (IEC) |
2005-12-22 |
| 22 |
SOT1123-1 |
HBGA |
plastic thermal enhanced ball grid array package; 324 balls; heatsink |
- - - (JEITA) MS-034 (JEDEC) 144E (IEC) |
2008-11-13 |
| 23 |
SOT684-8 |
HVQFN56 |
plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm |
- - - (JEITA) - - - (JEDEC) - - - (IEC) |
2009-2-24 |
| 24 |
SOT1030-1 |
HVQFN32 |
plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm |
--- (JEITA) --- (JEDEC) --- (IEC) |
2007-10-17 |
| 25 |
SOT1097-1 |
LBGA228 |
plastic low profile ball grid array package; 228 balls |
- - - (JEITA) - - - (JEDEC) - - - (IEC) |
2008-11-17 |
| 26 |
SOT1114-1 |
HWQFN56R |
plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 7 x 7 x 0.7 mm |
--- (JEITA) --- (JEDEC) --- (IEC) |
2008-10-7 |
| 27 |
SOT975B |
CDFM2 |
Earless flanged ceramic package; 2 leads |
|
2007-9-28 |
| 28 |
SOT1141-1 |
LFBGA385 |
plastic low profile fine-pitch ball grid array package; 385 balls |
- - - (JEDEC) |
2009-5-25 |
| 29 |
SOD128 |
FlatPower |
plastic surface-mounted package; 2 leads |
|
2007-9-12 |
| 30 |
SOT650-2 |
HVSON10 |
plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm |
- - - (JEITA) MO-229 (JEDEC) - - - (IEC) |
2009-3-18 |
| 31 |
SOT409B1 |
CDIP8 |
ceramic surface mounted package; 8 leads |
|
1998-1-27 |
| 32 |
SOT274-1 |
SDIP64 |
plastic shrink dual in-line package; 64 leads (750 mil) |
MS-021 (JEDEC) |
2003-2-13 |
| 33 |
SOT464-1 |
HSQFP240 |
plastic, heatsink shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm |
|
1999-11-12 |
| 34 |
SOT619-9 |
HVQFN48 |
plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm |
- - - (JEITA) MO-220 (JEDEC) - - - (IEC) |
2008-11-13 |
| 35 |
SOT1098-1 |
LFBGA268 |
plastic low profile fine-pitch ball grid array package; 268 balls |
|
2008-11-17 |
| 36 |
SOT1007A |
DFM6 |
Plastic flanged cavity package; 2 mounting slots; 6 leads |
|
2008-12-16 |
| 37 |
SOT1092-2 |
HVQFN36 |
plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm |
- - - (JEITA) - - - (JEDEC) |
2009-2-24 |
| 38 |
SOT96-2 |
SO8 |
plastic small outline package; 8 leads (straight); body width 3.9 mm |
|
2006-8-1 |
| 39 |
SOT1095-1 |
HBGA624 |
plastic thermal enhanced ball grid array package; 624 balls; heatsink |
- - - (JEITA) - - - (JEDEC) - - - (IEC) |
2008-11-17 |
| 40 |
SOT318-5 |
QFP80 |
plastic quad flat package; 80 leads (lead length 1.95 mm; slope angle 60 deg); body 14 x 20 x 2.8 mm |
|
2003-2-25 |
| 41 |
SOT1086-1 |
HVSON14 |
plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4.5 x 0.85 mm |
MO-229 (JEDEC) |
2008-7-3 |
| 42 |
sot804-3 |
HVQFN64 |
plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm |
- - - (JEITA) - - - (JEDEC) - - - (IEC) |
2009-2-24 |
| 43 |
SOT1102-1 |
BGA456 |
BGA456: plastic ball grid array package; 456 balls |
- - - (JEITA) MS-034 (JEDEC) 144E (IEC) |
2008-11-19 |
| 44 |
SOT122F |
CRPM4 |
studded ceramic package; 4 leads |
|
1999-3-29 |
| 45 |
SOT322-3 |
QFP160 |
plastic quad flat package;160 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; lead angle 60 deg |
MO-112 (JEDEC) |
2004-9-13 |
| 46 |
SOD81 |
GALF2 |
hermetically sealed glass package; ImplotecTM(1) technology; axial leaded; 2 leads |
|
1997-6-20 |
| 47 |
SOT942-1 |
HUQFN88U |
plastic thermal enhanced ultra thin quad flat package; no leads; 88 terminals; body 6 x 6 x 0.55 mm |
--- (JEITA) --- (JEDEC) --- (IEC) |
2007-11-14 |
| 48 |
SOT1000-1 |
HVQFN36R |
plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 6 x 5 x 0.85 mm |
|
2008-3-14 |
| 49 |
SOT618-6 |
HVQFN40 |
plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm |
- - - (JEITA) MO-220 (JEDEC) |
2009-3-4 |
| 50 |
SOT941-2 |
HVQFN112U |
plastic thermal enhanced very thin quad flat package; no leads; 112 terminals; UTLP based; body 7 x 7 x 0.9 mm |
--- (JEITA) --- (JEDEC) --- (IEC) |
2007-11-14 |
| 51 |
SOD91 |
GALF2 |
hermetically sealed glass package; ImplotecTM(1) technology; axial leaded; 2 leads |
|
1997-6-9 |
| 52 |
SOT1094-1 |
BGA376 |
plastic ball grid array package; 376 balls |
- - - (JEITA) MS-034 (JEDEC) 144E (IEC) |
2008-11-14 |
| 53 |
SOT1108-1 |
MTSSN4R |
metal thin special-shape package; no leads; 4 terminals; resin based; body 4 x 3 x 1 mm |
- - - (JEDEC) - - - (IEC) |
2008-8-20 |
| 54 |
SOT1061 |
HUSON3 |
plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm |
- - - (JEDEC) |
2008-10-7 |
| 55 |
SOT1093-1 |
TQFP80 |
TQFP80: plastic thin quad flat package; 80 leads; body 14 x 14 x 1.1 mm |
MS-026 (JEDEC) 136E19 (IEC) |
2008-11-14 |
| 56 |
SOT102-2 |
DIP18 |
plastic dual in-line package; 18 leads (300 mil); slim corner leads |
|
2003-2-13 |
| 57 |
SOT941-1 |
HVQFN112U |
plastic thermal enhanced very thin quad flat package; no leads; 112 terminals; body 7 x 7 x 0.9 mm |
--- (JEITA) --- (JEDEC) --- (IEC) |
2007-11-14 |
| 58 |
SOT935-1 |
HLQFN56R |
plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based; body 8 x 8 x 1.25 mm |
--- (JEITA) --- (JEDEC) |
2007-11-14 |
| 59 |
SOT96-3 |
SO8 |
plastic small outline package; 8 leads; body width 3.9 mm; body thickness 1.47 mm |
MS-012 (JEDEC) |
2006-8-25 |
| 60 |
SOT838-1 |
HLLGA68R |
plastic thermal enhanced low profile land grid array package; 68 lands; resin based; body 10 x 10 x 1.4 mm |
|
2007-11-14 |
| 61 |
SOT865-3 |
HVQFN32 |
plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm |
MO-220 (JEDEC) |
2009-2-5 |
| 62 |
SOT1096-1 |
BGA452 |
plastic ball grid array package; 452 balls |
MS-034 (JEDEC) 144E (IEC) |
2008-11-14 |
| 63 |
sot1032-3 |
HVQFN108U |
plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; low stand-off height; UTLP based; body 8 x 8 x 0.9 mm |
|
2008-10-17 |
| 64 |
SOT865-2 |
HVQFN32 |
plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm |
|
2009-3-5 |
| 65 |
SOT186B |
TO-220F |
plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 "full pack" |
|
2002-3-12 |
| 66 |
SOT1023 |
LFPAK2 |
Plastic single-ende surface-mounted package (LFPAK2); 4 leads |
|
2008-10-13 |
| 67 |
SOT1128-1 |
HLQFP256 |
plastic thermal enhanced low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm; heatsink |
MS-026 (JEDEC) |
2008-12-19 |
| 68 |
SOT1129-2 |
BGA324 |
plastic ball grid array package; 324 balls |
- - - (JEITA) MS-034 (JEDEC) 144E (IEC) |
2009-3-31 |
| 69 |
SOT979A |
CDFM2 |
Flanged LDMOST ceramic package; 2 mounting holes; 4 leads |
|
2008-9-4 |
| 70 |
SOT922-1 |
CDFM2 |
Ceramic earless flanged cavity package; 2 leads |
|
2005-11-22 |
| 71 |
SOT638-4 |
HTQFP100 |
plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad |
MS-026 (JEDEC) |
2008-11-12 |
| 72 |
SOT1006A |
DFM8 |
Plastic flanged cavity package; 2 mounting slots; 8 leads |
|
2008-12-15 |
| 73 |
SOT1131-1 |
HSOP44 |
plastic, heatsink small outline package; 44 leads; low stand-off height |
|
2009-3-23 |
| 74 |
SOT684-9 |
HVQFN56 |
plastic thermal enhanced very thin quad flat package; no leads; 56 terminals |
- - - - - - - - (JEITA) - - - - - - - - (JEDEC) - - - - - - - - (IEC) |
2009-5-25 |
| 75 |
SOT612-5 |
HLQFP144 |
plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad |
MS-026 (JEDEC) |
2008-11-21 |
| 76 |
SOT841-4 |
HTQFP80 |
plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad |
MS-026 (JEDEC) |
2006-6-20 |
| 77 |
SOT1136-1 |
BGA420 |
plastic ball grid array package; 420 balls |
- - - (JEITA) MS-034 (JEDEC) 144E (IEC) |
2009-5-20 |