This page brings together detailed packaging information, for both discrete and IC packages.
It includes:

• a package tree, enabling you to explore our total packaging offer quickly. Click on any branch to expand further sub-branches
• a dedicated packaging search engine, which accepts partial package names
• a search for packages using the Philips marking code.

Package Tree

To find a package you can browse the package tree.

  Ceramic (75)
  Glass (16)
  Metal (1)
  Plastic (691)

# Package version Package name Package description Reference codes Issue date 1 SOT566-1  HSOP24  plastic, heatsink small outline package; 24 leads    2003-7-23  2 SOT819-1  HLLGA28R  plastic thermal enhanced low profile land grid array package; 28 lands; resin based; body 6 x 6 x 1.4 mm    2007-11-14  3 SOT619-3  HVQFN48  plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm  MO-220 (JEDEC)  2001-9-7  4 SOT96-2  SO8  plastic small outline package; 8 leads (straight); body width 3.9 mm    2006-8-1  5 SOT318-5  QFP80  plastic quad flat package; 80 leads (lead length 1.95 mm; slope angle 60 deg); body 14 x 20 x 2.8 mm    2003-2-25  6 SOT840-1  HLLGA52R  plastic thermal enhanced low profile land grid array package; 52 lands; resin based; body 8 x 7 x 1.4 mm    2007-11-14  7 SOT1086-1  HVSON14  plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4.5 x 0.85 mm  MO-229 (JEDEC)  2008-7-3  8 SOT1113-1  HVQFN44  plastic thermal enhanced very thin quad flat package; no leads; 44 terminals; body 9 x 9 x 0.85 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2008-8-29  9 SOT409A1  CDIP8  ceramic surface mounted package; 8 leads    2001-3-1  10 SOT1032-1  HVQFN108U  plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; UTLP based; body 8 x 8 x 0.9 mm    2008-10-17  11 SOT619-4  HVQFN48  plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm  MO-220 (JEDEC)  2002-9-30  12 SOT122F  CRPM4  studded ceramic package; 4 leads    1999-3-29  13 SOT322-3  QFP160  plastic quad flat package;160 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; lead angle 60 deg  MO-112 (JEDEC)  2004-9-13  14 SOT942-1  HUQFN88U  plastic thermal enhanced ultra thin quad flat package; no leads; 88 terminals; body 6 x 6 x 0.55 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2007-11-14  15 SOD81  GALF2  hermetically sealed glass package; ImplotecTM(1) technology; axial leaded; 2 leads    1997-6-20  16 SOT1000-1  HVQFN36R  plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 6 x 5 x 0.85 mm    2008-3-14  17 SOT941-2  HVQFN112U  plastic thermal enhanced very thin quad flat package; no leads; 112 terminals; UTLP based; body 7 x 7 x 0.9 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2007-11-14  18 SOD91  GALF2  hermetically sealed glass package; ImplotecTM(1) technology; axial leaded; 2 leads    1997-6-9  19 SOT943-1  HUQFN68U  plastic thermal enhanced ultra thin quad flat package; no leads; 68 terminals; body 8 x 8 x 0.55 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2007-11-14  20 SOT944-1  HWQFN68  plastic thermal enhanced very very thin quad flat package; no leads; 68 terminals; body 8 x 8 x 0.65 mm    2006-6-1  21 SOT1032-2  HVQFN108U  plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; low stand-off height; UTLP based; body 8 x 8 x 0.9 mm    2008-10-16  22 SOT630-2  TFBGA112  plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.7 mm  MO-195 (JEDEC)  2006-4-27  23 SOT102-2  DIP18  plastic dual in-line package; 18 leads (300 mil); slim corner leads    2003-2-13  24 SOT941-1  HVQFN112U  plastic thermal enhanced very thin quad flat package; no leads; 112 terminals; body 7 x 7 x 0.9 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2007-11-14  25 SOT935-1  HLQFN56R  plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based; body 8 x 8 x 1.25 mm  --- (JEITA) --- (JEDEC)  2007-11-14  26 SOT96-3  SO8  plastic small outline package; 8 leads; body width 3.9 mm; body thickness 1.47 mm  MS-012 (JEDEC)  2006-8-25  27 SOT1036-1  HUQFN76U  plastic thermal enhanced ultra thin quad flat package; no leads; 76 terminals; UTLP based; body 6 x 6 x 0.55 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2007-12-1  28 SOT838-1  HLLGA68R  plastic thermal enhanced low profile land grid array package; 68 lands; resin based; body 10 x 10 x 1.4 mm    2007-11-14  29 SOD95  TO-220  plastic single-ended package; low-profile 2-lead TO-220  low-profile 2-lead TO-220 (JEDEC)  1999-9-13  30 SOT1119-1  HBGA432  plastic thermal enhanced ball grid array package; 432 balls; heatsink  --- (JEITA) MS-034 (JEDEC) 144E (IEC)  2008-10-15  31 SOD27-1  SOD27  Hermetically sealed glass package; axial leaded; 2 leads  SC-40 (JEITA) DO-35 (JEDEC) A24 (IEC)  2005-12-22  32 SOT186B  TO-220F  plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 "full pack"    2002-3-12  33 SOT867-1  SOJ36  plastic small outline package; 36 leads (J-bent); body width 4.9 mm MAG NIET op WWW!!!    2004-12-14  34 SOT1030-1  HVQFN32  plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2007-10-17  35 SOT1128-1  HLQFP256  plastic thermal enhanced low profile quad flat package; 256 leads; body 28 x 28 x 1.6 mm; heatsink  MS-026 (JEDEC)  2008-12-19  36 SOT1114-1  HWQFN56R  plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 7 x 7 x 0.7 mm  --- (JEITA) --- (JEDEC) --- (IEC)  2008-10-7  37 SOT979A  CDFM2  Flanged LDMOST ceramic package; 2 mounting holes; 4 leads    2008-9-4  38 SOD128  FlatPower  plastic surface-mounted package; 2 leads    2007-9-12  39 SOT975B  CDFM2  Earless flanged ceramic package; 2 leads    2007-9-28  40 SOT409B1  CDIP8  ceramic surface mounted package; 8 leads    1998-1-27  41 SOT274-1  SDIP64  plastic shrink dual in-line package; 64 leads (750 mil)  MS-021 (JEDEC)  2003-2-13  42 SOT464-1  HSQFP240  plastic, heatsink shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm    1999-11-12  43 SOT841-4  HTQFP80  plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad  MS-026 (JEDEC)  2006-6-20